The BTO has been developed for reflow soldering of hybrid boards, SMT board and curing glue or thick film pastes. The machine is suited for small and medium series of assembly work.
Low or mid production requirement in the range of 300-600pcs/8hours (A 300x300 PCB is taken as reference).
Lead-free requirement.
It is possible to bake some no-PCB products if the requirements for a uniform temperature are fulfilled.
Tight space and tight budget.
DERSCRIPTIONS
The reflow oven uses a micro-processor control over the temperature, which enables the storage of 16 groups of temperature parameters and adds 2 additional ports for temperature testing.
The CE certificated blower is specially design for lead-fre reflow oven. It runs stable and with lower noise.
Upper zone hood and electrical box cover can be opened easily. This makes the oven convenient for cleaning and maintenance.
The inner tunnel of the oven is made of stainless steel which is easy to clean.
All upper zones are with forced air convection which provides great temperature accuracy and uniform.
